The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
Aug. 21, 2002
Applicant:
Inventors:
Hirotaka Jiten, Osaka, JP;
Michiya Kusaka, Osaka, JP;
Assignee:
Espec Corp., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/200 ;
U.S. Cl.
CPC ...
H01R 1/200 ;
Abstract
In order to carry out the electric property evaluation of internal wiring of an IC, the IC is attached to an IC socket, and terminals of the IC socket are connected with the external wiring via leads and coaxial connectors. The IC is directly in touch with a heating plate, for making the IC have a high temperature. The IC socket is provided with protrusions thereon, for forming a gap between the IC socket and the IC. On this account, it is possible to acquire an IC socket module in which the temperature of the IC is kept consistent when the evaluation of the internal wiring and wiring members of the IC is carried out at a high temperature.