The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2004

Filed:

Oct. 08, 2002
Applicant:
Inventors:

Simon Muff, Höhenkirchen, DE;

Martin Gall, München, DE;

Oliver Kiehl, Charlotte, VT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

A semiconductor module having a configurable data width of an output bus has data connecting pads as well as driver circuits having a respective output that is connected to an associated data connecting pad. At least one of the data connecting pads, which is not used for interchanging data or commands during operation, is permanently connected to a connection for an internal supply voltage. Thus, in a module configuration with a reduced number of data lines being used, the remaining data lines can be operated at an increased frequency, since the signal-to-ground ratio is improved.


Find Patent Forward Citations

Muff, Simon. (2004). Semiconductor module having a configurable data width of an output bus, and a housing configuration having a semiconductor module (U.S. Patent No. 6765302). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6765302

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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