The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2004

Filed:

Apr. 23, 2003
Applicant:
Inventors:

Yasushi Fujita, Kanagawa, JP;

Ryoji Sato, Kanagawa, JP;

Fujio Noguchi, Tokyo, JP;

Katsumi Endo, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 2/500 ;
U.S. Cl.
CPC ...
H01R 2/500 ;
Abstract

A feature expansion module is provided which includes a generally rectangular body ( ) installable in a host device ( ), a first connection terminal ( ) provided at one side of the body ( ) for electrical connection with the host device ( ), a feature expansion unit ( ) provided inside the body ( ) and having one or more functions, one or more recesses ( ) formed contiguously to an insertion slot ( ) formed at the other side of the body ( ) and through which an integrated circuit chip ( ) incorporating integrated circuit elements is inserted, to receive the integrated circuit chip ( ), a second connection terminal ( ) provided in the recess ( ) for electrical connection with a group of terminals provided at the integrated circuit chip ( ), and a controller ( ) built in the body ( ) to control the integrated circuit chip ( ) set in the recess ( ).


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