The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Sep. 22, 2000
Daniel J. Burns, Rome, NY (US);
David C. Williamson, Holland Patent, NY (US);
Mark T. Pronobis, Rome, NY (US);
The United States of America as represented by the Secretary of the Air Force, Washington, DC (US);
Abstract
A novel microelectromechanical system artificial neural network (MEMS ANN) device performs the function of a conventional artificial neural network node element. Micro-machined polysilicon or high aspect ratio composite beam micro-resonators replace as computational elements the silicon transistors and software simulations of prior-art ANNs. The basic MEMSANN device forms a non-linear (e.g., sigmoid) function of a sum of products. Products of the magnitudes of sine waves, applied to the input drive comb and shuttle magnitudes, are formed in the frequency domain and summed by coupling a plurality of resonators with a mechanical coupling frame, or by integrating them into one resonator. A sigmoid function is applied to the sum of products by shaping the overlap capacitance of the output comb fingers of the resonator. Methods of building and using various single MEMS ANN devices and multi-layered arrays of MEMS ANN circuits are also described. These novel MEMS ANNs exhibit an attractive combination of performance characteristics, compared to conventional hardware ANNs that use silicon transistors or simulations of ANNs running in software on digital computers, including lower cost, simpler design, wider temperature range, greater radiation tolerance, and lower operating and standby power. These advantages favorably impact system weight and size because of reduced shielding, cooling, and power requirements.