The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Jan. 07, 2003
Masazumi Amagai, Olta, JP;
Masako Watanabe, Olta, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
Apparatus and method for assembling a semiconductor device on a wiring substrate is disclosed, wherein Pb (lead) is not used and the chance of generation of defects is reduced. Semiconductor package ( ) has solder balls ( ) containing Sn (tin), Ag (silver) and Cu (copper). Wiring substrate has connecting terminals for connecting solder balls ( ). The connecting terminals ( ) have an Au (gold) layer ( ) and a Ni layer ( ). In the operation for assembling semiconductor package ( ) onto wiring substrate ( ), because solder balls ( ) are heated and fixed on connecting terminals ( ), Au in Au layer ( ) diffuses into balls ( ). Because Au is contained in solder balls ( ), a high bonding strength is obtained, and the chance of generation of defects is reduced.