The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2004

Filed:

Mar. 12, 2003
Applicant:
Inventors:

Haruo Kojima, Kawasaki, JP;

Tomoyuki Kitani, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract

A microwave integrated circuit, includes: a dielectric substrate having a signal line on a front surface of the dielectric substrate and a mount pad disposed adjacent to an end of the signal line in a longitudinal direction of the signal line; a semiconductor chip having an upper electrode and a lower electrode provided on opposite surfaces of the semiconductor chip, the lower electrode being mounted on the mount pad; a bonding block connecting a bottom surface of the bonding block to the end in the longitudinal direction of the signal line; and a wiring member configured to bond the upper electrode of the semiconductor chip and a top surface of the bonding block together.


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