The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Mar. 07, 2003
Takehiko Maeda, Kanagawa, JP;
Jun Tsukano, Kanagawa, JP;
NEC Electronics Corporation, , JP;
Abstract
A stacked package semiconductor device includes a semiconductor chip package, which has been reduced in thickness through a polishing after being sealed in a resin package, and a semiconductor flip chip electrically connected to the semiconductor chip package through conductive bumps embedded in an underfill resin layer below the semiconductor flip chip; the semiconductor chip package is stacked with the semiconductor flip chip, and the semiconductor flip chip is reduced in thickness through the polishing after the resultant structure is molded in a synthetic resin package; although the semiconductor chip package and semiconductor flip chip are reduced in thickness, the polishing is carried out after the semiconductor chip are sealed in the resin so that the semiconductor chips are less broken during the polishing.