The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Apr. 07, 2003
Kiyoharu Kishimoto, Yokohama, JP;
Ryuzo Fukao, Moriya-machi, JP;
Koji Yamaguchi, Moriya-machi, JP;
Hiroyuki Tsukamoto, Toride, JP;
Yuji Yamashita, Moriya-machi, JP;
Yuji Kikuchi, Ishige-machi, JP;
Tomonori Kanai, Moriya-machi, JP;
Hitachi Maxell, Ltd., Ibaraki, JP;
Abstract
For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.