The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Mar. 05, 2002
Yoshiyasu Horiuchi, Kawasaki, JP;
Yasuaki Hirokawa, Kawasaki, JP;
Fujitsu General Limited, Kawasaki, JP;
Abstract
According to this invention, thermal expansion microcapsules can be substantially evenly mixed with a base resin and an expected expansion coefficient for the thermal expansion microcapsules can be obtained during resin molding in a mold. Specifically, this invention provides a method for manufacturing a synthetic resin molding using thermal expansion microcapsules in which the thermal expansion microcapsules are mixed with a base resin and the mixture undergoes resin molding in a mold, wherein the thermal expansion microcapsules are granulated with a given binder resin under a temperature condition in which the thermal expansion microcapsules are not thermally expanded; then the mixture is mixed with the base resin; and the mixture undergoes resin molding.