The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Apr. 17, 2001
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A bubble-jet type ink-jet printhead is provided. The ink-jet printhead includes: a substrate; a nozzle plate including a plurality of nozzles, which is separated a predetermined space from the substrate; walls for closing the space between the substrate and the nozzle plate and then forming a common chamber between the substrate and the nozzle plate; a plurality of resistive layers, formed on the substrate within the common chamber corresponding to the plurality of nozzles, each resistive layer encircling the central axis passing through the center of each nozzle; a plurality of pairs of wiring layers formed on the substrate, each pair of wiring layers being connecting to each resistive layer and extending to the outside of the common chamber; and a plurality of pads which are disposed at the outside of the common chamber on the substrate and electrically connected to the wiring layers. The printhead is constructed such that the space between the nozzle plate and the substrate forms a common chamber and there is no ink channel having a complicated structure, thereby significantly suppressing clogging of nozzles by foreign materials or solidified ink. The printhead is easy to design and manufacture due to its simple structure, thereby significantly reducing the manufacturing cost. In particular, its simple structure permits flexibility in selecting a wide range of alternative designs and thus patterns in which the nozzles are arranged. Furthermore, the printhead can be manufactured by a fabrication process for a typical semiconductor device, thereby facilitating high volume production.