The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Nov. 24, 1998
Yoshinobu Kaneyama, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
When a substrate electrode ( ) formed on a semiconductor substrate ( ) and a device electrode ( ) formed on an optical device ( ) are joined to each other by solder to mount the device ( ) on the substrate ( ), a solder piece attached to the substrate electrode ( ) is melted in inactive liquid ( ) to form a solder bump ( ). The substrate electrode ( ) on which the solder bump ( ) is formed and the device electrode ( ) are matched with each other, and the device ( ) is disposed so as to confront the substrate ( ) in the inactive liquid ( ). Thereafter, when the solder bump ( ) is melted in the inactive liquid ( ) and ultrasonic vibration ( ) is applied to join the device electrode ( ) and the substrate electrode ( ) to each other, the positioning of the device electrode ( ) to the substrate electrode ( ) is performed by the surface tension of the melted solder bump ( ), and then the solder bump ( ) is solidified.