The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6759754 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 06, 2004

Filed:

Sep. 27, 2002
Applicant:
Inventors:

Hirotaka Nishizawa, Fuchu, JP;

Hideki Tanaka, Sagamihara, JP;

Yuichiro Yamada, Kawasaki, JP;

Tomoaki Kudaishi, Kodaira, JP;

Akira Katsumata, Tokyo, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ; H05K 1/14 ; H05K 5/06 ;
U.S. Cl.
CPC ...
H01L 2/3544 ; H05K 1/14 ; H05K 5/06 ;
Abstract

A CF card ( ) comprises: a casing constituted by two panel plates ( ) and a frame ( ); and a printed wiring board ( ) accommodated in the casing. A plurality of claw-like engaging parts ( ) are provided to the peripheries of the panel plates ( ). When the CF card ( ) is assembled, the engaging parts ( ) of the first panel plate ( ) are inserted into through holes of a long groove ( ) provided in the frame ( ) and then the printed wiring board ( ) is mounted on the panel plate ( ) located at the inside of the frame ( ). Thereafter, the engaging parts ( ) of the second panel plate ( ) are inserted into the through holes of the long groove ( ) from the surface located in the opposite side of the frame ( ). There are two types of engaging parts ( ): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts ( ) of one panel plate ( ) are inserted into the holes of the engaging parts ( ) of the other panel plate ( ).


Find Patent Forward Citations

Nishizawa, Hirotaka. (2004). Semiconductor device and its manufacturing method (U.S. Patent No. 6759754). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6759754

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