The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
Oct. 12, 1999
Thomas Philip Budka, Shirley, MA (US);
The Whitaker Corporation, Wilmington, DE (US);
Abstract
A method for making a bond-wire interconnect to pass signals between different substrates is described. According to this process, a first compensated bond wire interconnect is made to connect two substrates of a first type at an operating frequency, the first interconnect comprising a bond-wire of a fixed length and a first pair of compensation structures formed from a lowpass filter prototype. A second compensated bond wire interconnect is made to connect two substrates of a second type at the operating frequency, the second interconnect having a bond-wire of the fixed length and a second pair of compensation structures formed from the lowpass filter prototype. A bond-wire of the fixed length, one compensation structure from the first pair, and one compensation structure from the second pair, are combined to make a third compensated bond wire interconnect to connect a substrate of the first type with a substrate of the second type at the operating frequency.