The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
May. 17, 2002
Nitto Denk Corporation, Osaka, JP;
Abstract
The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer onto a metal foil by a wet coagulating method, wherein a metal foil including a conductive bump having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height and a resin porous layer laminated integrally, the conductive bump being exposed. The present invention provides another metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height, a resin porous layer laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer, in which the conductive bump is exposed from the resin porous layer.