The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
Oct. 19, 2001
Yoshimi Sugaya, Chiba, JP;
Makoto Iwakiri, Chiba, JP;
Hitachi Powdered Metals Co., Ltd., Chiba, JP;
Abstract
Disclosed is a die for compacting a powdered material. The die has a die body having a penetrating die cavity to which a couple of punches are adapted to apply for pressing the powdered material to be supplied to form a compact, and a die holder having a bore into which the die body is shrink fitted. The die cavity is provided with a coating composed of a material which is selected from the group consisting of titanium carbide, titanium nitride, alumina, titanium cyanide, hafnium nitride, chromium nitride, tungsten carbide and DLC, and the die holder is composed of a steel material which is prepared by tempering at a temperature higher than a treatment temperature at which the coating is provided on the die cavity. The die cavity is tapered at a ratio within a range of 1/5,000 to 1/1,000.