The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
Dec. 10, 2001
Mehrdad Ziari, Pleasanton, CA (US);
Robert J. Lang, Alamo, CA (US);
Tanya K. Oleskevich, Victoria, CA (US);
Vivek Agrawal, Santa Clara, CA (US);
Ashok P. Kanjamala, Santa Clara, CA (US);
Donald C. Hargreaves, Sidney, CA;
Harrison L. Ransom, Antioch, CA (US);
David Dawson, Livermore, CA (US);
Radhakrishnan L. Nagarajan, Cupertino, CA (US);
JDS Uniphase Corporation, San Jose, CA (US);
Abstract
An optical connection module attaches an active or passive optical component to a substrate and aligns the optical component with a first laser. The optical connection module includes a fiber submount that is attached to the substrate and that includes a thermally insulating material having a thickness greater than 20 micrometers. The optical component is soldered to the fiber submount using heat from a second laser. A laser submount is attached to the substrate. The first laser is attached to the laser submount. A fiber bonding pad is located between the thermally insulating material and the optical component. The thermally insulating material and the fiber bonding pad promote lateral heat transfer and limit vertical heat transfer to the substrate during soldering. The thermally insulating material can be integrally formed in the substrate by flame hydrolysis or by anodic bonding.