The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2004

Filed:

Apr. 30, 2002
Applicant:
Inventor:

Rene Tews, Dresden, DE;

Assignee:

Infineon Technologies AG, Münich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/182 ;
U.S. Cl.
CPC ...
H01L 2/182 ;
Abstract

An integrated circuit is formed by a method having the steps of providing a circuit substrate with a first metallized region, providing a first insulation layer covered by a silicon layer, patterning the first insulation layer and silicon layer to form a first insulation region and first silicon region, then forming a second metallized layer on the silicon region, heating the material so that the second metal layer diffuses into the silicon layer to form a metal silicide region, which is subsequently covered by a second insulating layer having a contact with an interconnect to enable contacting an antifuse formed by the metal silicide region.


Find Patent Forward Citations

Tews, Rene. (2004). Integrated circuit having an antifuse and a method of manufacture (U.S. Patent No. 6756254). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6756254

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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