The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2004

Filed:

May. 05, 2003
Applicant:
Inventors:

Chih-Ching Lo, Taipei, TW;

Chen Ching Hung, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A heat dissipation apparatus for circuit boards includes a heat transfer plate, at least one heat transfer tube located on the heat transfer plate, a first radiator located on the heat transfer plate, a shell mounted onto the heat transfer plate, an airflow generator located in the shell, at least one latch member latching on the heat transfer plate, and a filter located on the shell. The heat dissipation apparatus is mounted onto a circuit board (such as, but not limited to, interface card, processor circuit board) for discharging heat generated by various elements to ensure stable operations of the elements.


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