The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Aug. 20, 2002
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
Electronic equipment comprises a wiring board, an electronic component mounted on the wiring board and having a heat dissipation portion on a surface thereof, and an insulating heat dissipation plate thermally connected to the electronic component, wherein the heat dissipation portion is directly connected to the heat dissipation plate via a heat conductive bonding material that includes metal. The heat dissipation plate is a ceramic plate having at least one land for connecting the electronic component thereto, or a resin plate containing highly heat conductive material. By directly connecting the insulating heat dissipation plate to an electronic component generating heat, an insulating plate between the heat dissipation plate and the electronic component is not required.