The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Aug. 02, 2002
Toshiaki Kanenari, Hyogo, JP;
Toshihiro Nakajima, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A resin-sealed semiconductor device is provided which allows unwanted air to be bled out steadily and readily from the space defined between the resistor of a plate-like shape and the insulating substrate in the resin sealing step. The resin-sealed semiconductor device includes a resistor of a plate-like form anchored at both ends to the upper main surface of a substrate thereof. A space is provided between the resistor and the substrate. The primary components including the resistor mounted on the substrate are sealed with a curing resin material. In particular, the resistor has an aperture provided in a portion thereof, which is opposite to the substrate and defines the space with the substrate, for communication between the space and the upper side of the resistor.