The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Feb. 19, 2002
Applicant:
Inventors:
Kaidong Ye, Singapore, SG;
Chengwu An, Singapore, SG;
Minghui Hong, Singapore, SG;
Yongfeng Lu, Singapore, SG;
Assignee:
Data Storage Institute, , SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 2/600 ;
U.S. Cl.
CPC ...
B23K 2/600 ;
Abstract
The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.
Ye, Kaidong. (2004). Method and apparatus for cutting a substrate using laser irradiation (U.S. Patent No. 6753500). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6753500
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile