The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Aug. 07, 2002
Applicant:
Inventors:
Yuji Nakamura, Tokyo, JP;
Yuki Kudo, Tokyo, JP;
Assignee:
Yamaichi Electronics Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/362 ; G01R 3/102 ; H05K 7/20 ;
U.S. Cl.
CPC ...
H01R 1/362 ; G01R 3/102 ; H05K 7/20 ;
Abstract
A semiconductor device socket having one or more heat sinks for dissipating heat from the object under test. The one or more heat sinks are held by arm members disposed in the semiconductor device socket for providing rotational movement about the object under test accommodation portion.
Quick Actions:
Nakamura, Yuji. (2004). Semiconductor device-socket having rotationally movable heat sinks (U.S. Patent No. 6752645). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6752645
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile