The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Dec. 28, 2001
Naoyoshi Kimura, Tokyo, JP;
Fumio Takahashi, Tokyo, JP;
Masahiko Yamaki, Chiba, JP;
Akihiko Imagawa, Aichi, JP;
Mitsuharu Mikawa, Aichi, JP;
Ono Sangyo Co., Ltd., Tokyo, JP;
Abstract
In a mold device for injection molding of synthetic resin having a cavity surface alternately heated and cooled and a bottoming structure for producing a product having a bored portion like a window, a bottoming portion for the production of a product having a bored portion is provided on a parting surface of the mold and a vacant space is provided in the bottoming portion. Thus, the contact area of the bottoming portion is reduced and a contact pressure of the bottoming portion and thermal strain due to a temperature difference between the cavity side mold and core side mold are reduced, so that it is possible to prevent occurrence of crack in a portion located immediately outside the window of the product. In a mold device for injection molding of synthetic resin having a cavity surface alternately heated and cooled and a slide structure, a mold base and a slide cavity block arranged in the slide core provided in the mold base are separately thermally controlled so that it is possible to prevent galling between the mold base and the slide core of the slide structure.