The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Aug. 23, 2001
John P. Roos, Wakeman, OH (US);
Thomas A. Loparo, Elyria, OH (US);
William L. Palmer, Lakewood, OH (US);
Joseph C. Waryu, Amherst, OH (US);
Stephen P. Stewart, Stockton, CA (US);
Charles F. Nagy, North Ridgeville, OH (US);
Lenzie L. Borders, Cleveland Heights, OH (US);
John C. Dillon, Lorain, OH (US);
Nordson Corporation, Westlake, OH (US);
Abstract
A hot melt high temperature material application system with application device pressure monitoring and heated recirculating manifold uses high temperature pressure transducers with each application device such as spray guns to monitor hot melt material application. A material supply line fitting has a calibrated orifice at the interface with a device manifold associated with each application device. In another embodiment, the calibrated orifice is located in a fluid passageway of the device manifold. The calibrated orifice corresponds in size to the opening of a nozzle of the application device. Heated recirculating manifolds are combined with hot melt material supply systems to provide uniform pressure to multiple application devices, and to recirculate material back through the supply system. Each recirculating manifold includes a heater, pressure regulator, and a recirculation path. The manifolds may be directly or remotely connected to one or more hot melt material supply systems.