The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Dec. 17, 2002
Applicant:
Inventors:
Katsuji Sekita, Kanagawa, JP;
Tadahiko Nagasawa, Kanagawa, JP;
Assignee:
Amada Company, Limited, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 5/02 ; B21D 5/08 ;
U.S. Cl.
CPC ...
B21D 5/02 ; B21D 5/08 ;
Abstract
A bending method is provided for bending two sides of a workpiece to form flanges. The bending method includes measuring a bent flange to obtain a flange dimension. The bending method also includes setting a back gauge value for processing another flange, based on a measured dimension of the workpiece. The other flange is bent using the set back gauge value.
Sekita, Katsuji. (2004). Bending method and bending system (U.S. Patent No. 6751993). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6751993
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile