The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2004

Filed:

Oct. 17, 2002
Applicant:
Inventors:

Yutaka Nakazawa, Miyagi, JP;

Ryuichi Kasahara, Miyagi, JP;

Koji Sakata, Miyagi, JP;

Assignee:

NEC Tokin Corporation, Miyagi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 9/00 ; H01G 2/10 ;
U.S. Cl.
CPC ...
H01G 9/00 ; H01G 2/10 ;
Abstract

An electric double layer capacitor is disclosed which is capable of preventing transmission of an electrolytic solution vaporized in a basic cell through current collectors and capable of improving a yield. A method for preparing the electric double layer capacitor is also disclosed. The electric double layer capacitor includes a basic cell prepared by the steps of: applying a current collector onto a surface of a substrate; disposing an electrically insulating gasket element on the surface the substrate in such a manner that the current collector laterally abuts on the gasket element to define a concavity; placing a polarizable electrode impregnated with an electrolytic solution on the surface of the current collector; oppositely disposing two intermediate products prepared through the foregoing steps on a separator in such a manner that the gasket elements abut on surfaces of a peripheral portion of the separator; fusion-bonding the gasket elements together to laterally cover the separator with the resulting unified gasket; and removing the substrates from the current collectors and the gasket. The substrate has a vapor transmission rate of a predetermined one or lower with respect to the electrolytic solution vaporized at a temperature of the fusion-bonding.


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