The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2004
Filed:
Jul. 31, 2002
John D. Spano, Austin, TX (US);
John Lee Nistler, Martindale, TX (US);
Advanced Micro Devices, Sunnyvale, CA (US);
Abstract
A metallization system ( ) suitable for use in a semiconductor component and a method for fabricating the metallization system ( ). The metallization system ( ) includes a dielectric material ( ) disposed on a major surface ( ) of a substrate ( ). The dielectric material ( ) contains a dielectric filled plug ( ) over a conductor ( ). A metal filled plug ( ) extends through the dielectric filled plug ( ). The metal of the metal filled plug ( ) electrically contacts the conductor ( ). The metallization system ( ) may be fabricated by etching a via ( ) in the dielectric material ( ) and filling the via ( ) with a dielectric material ( ) having a dielectric constant that is greater than the dielectric constant of the dielectric material ( ) disposed on the major surface. A via ( ) is formed in the dielectric material ( ) that fills the via ( ) and the via ( ) is filled with a metal.