The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2004
Filed:
Oct. 24, 2002
Steven Henry Macomber, Tucson, AZ (US);
Jeffrey Powers, Tucson, AZ (US);
Spectra Physics Semiconductor Lasers, Inc., Tucson, AZ (US);
Abstract
In order to provide an improved heat transfer interface between an solid state device and a heat sink to which it is soldered, one or more “vents” are provided in the interface between the solid state device and the heat sink to prevent the entrapment of gases that could form solder voids. Advantageously, the provision of such vents in the interface surface geometry of the semiconductor may be effected by the use of appropriate masking and etching following the epitaxial regrowth process. Alternatively, the heat sink or a solder preform may be provided with suitable notches. The use of such “die-bond vents” also allows solder, after melting, to be forced under the chip by external gas pressure such that no solder voids are left.