The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2004
Filed:
Oct. 22, 1999
Dan W. Chilcott, Greentown, IN (US);
Hamid Reza Borzabadi, Noblesville, IN (US);
Douglas Ray Sparks, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A semiconductor device and method by which a device chip with a micromachine is directly surface mounted to a circuit board. A capping chip is bonded to the device chip and encloses the micromachine. The capping chip has a first surface facing the device chip, an oppositely-disposed second surface, and electrical interconnects through the capping chip between the first and second surfaces. The electrical interconnects electrically communicate with runners on the device chip that are electrically connected to the micromachine, thereby providing a signal path from the micromachine to the exterior of the device. The capping chip further includes bond pads for electrical communication with the electrical interconnects. With the bond pads, the capping chip can be surface mounted to a circuit board by reflowing solder bumps formed on the bond pads. Depending on the placement of the bond pads on the capping chip, the semiconductor device can be mounted to the circuit board with the capping chip between the device chip and circuit board, or the semiconductor device can be mounted with one side of the device attached to the circuit board.