The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2004
Filed:
Mar. 20, 2002
Shigenori Katayama, Suwa, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A substrate device has, on a substrate, a first conductive film, a first insulating film formed thereon, a second insulating film bonded thereon, and a second conductive film formed thereon. A contact hole connecting the first and second conductive films is opened so as to penetrate through a bonding interface thereof. The area of the contact hole penetrating through the bonding interface is not eroded by an etching solution. Thus, where manufacturing a substrate device in which a contact hole penetrating through a bonding interface needs to be formed, it is unlikely that a defect will occur in the area where the contact hole passing through the bonding interface, thereby enhancing device reliability and manufacturing yield.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile