The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2004

Filed:

Aug. 22, 2002
Applicant:
Inventors:

Chenggang Xie, Phoenix, AZ (US);

Joseph W. Bostaph, Gilbert, AZ (US);

Xunhu Dai, Gilbert, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F04B 1/700 ; F04B 3/910 ; E03B 1/100 ; F16K 1/500 ;
U.S. Cl.
CPC ...
F04B 1/700 ; F04B 3/910 ; E03B 1/100 ; F16K 1/500 ;
Abstract

An exemplary method for making a micropump device is disclosed as providing inter alia a substrate ( ), an inlet opening ( ), and outlet opening ( ), a pump chamber ( ) and flapper valves ( ). The fluid inlet channel ( ) is generally configured to flow a fluid through/around the inlet opening flapper valve ( ). The outlet opening flapper valve ( ) generally provides means for preventing or otherwise decreasing the incidence of outlet fluid re-entering either the pumping cavity ( ) and/or the fluid inlet channel ( ). Accordingly, the reduction of backflow generally tends to enhance overall pumping efficiency. Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve micropump operation in any microfluidic application. Exemplary embodiments of the present invention representatively provide for substantially self-priming gas/liquid micropumps that may be readily integrated with existing portable ceramic technologies for the improvement of device package form factors, weights and other manufacturing and/or device performance metrics.


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