The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6747329 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 08, 2004

Filed:

Oct. 16, 2001
Applicant:
Inventors:

Shinji Yoshihara, Nagoya, JP;

Yasutoshi Suzuki, Okazaki, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/984 ;
U.S. Cl.
CPC ...
H01L 2/984 ;
Abstract

A plularity of sensor chips, each having strain gauges and a thin diaphragm, are formed on a semiconductor wafer having an upper layer and a lower layer forming a P-N junction plane therebetween. The sensor chips are separated into individual pieces by dicing along column and row interstices dividing the sensor chips. Conductor lines for supplying an electrical voltage for electrochemically etching the diaphragms are formed on and along the interstices. All of the conductor lines are removed by a dicing blade having a wider width than the conductor lines to avoid electrical leakage due to particles of conductor lines leftover on side surfaces of the diced out sensor chips.


Find Patent Forward Citations

Yoshihara, Shinji. (2004). Semiconductor sensor chip having diaphragm and method of manufacturing the same (U.S. Patent No. 6747329). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6747329

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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