The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2004
Filed:
Feb. 16, 2000
Applicant:
Inventors:
Assignee:
Mitsubishi Engineering-Plastics Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 ;
U.S. Cl.
CPC ...
B32B 7/02 ;
Abstract
The present invention relates to a multilayered molding comprising at least two of a layer A and a layer B, in which the layers A are formed on both sides of the layer B, each layer A comprises a same or different thermoplastic resin compositions, the layer A has a flexural modulus according to ASTM D790 of not less than 5,000 kg/cm , the layer B comprises a thermoplastic resin composition and has a flexural modulus according to ASTM D790 of not more than 5,000 kg/cm , and the ratio of flexular modulus of the layer A to flexural modulus of the layer B is not less than 5.