The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2004
Filed:
Sep. 14, 2001
Hiroshi Ishibuchi, Hiroshima-ken, JP;
Hideo Okuhara, Hiroshima-ken, JP;
Akihisa Fujita, Hiroshima-ken, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Abstract
A bonded sheet material manufacturing system capable of setting a moisture content of various types of sheet members to be bonded to each other to an optimum value for stably producing a bonded sheet material with less bonding failure and less warp at all times, where the sheet members are heated by individual sheet member heating means and then bonded to each other to produce the bonded sheet material. The system comprises a moisture content detecting means provided for at least one of the sheet members for detecting a moisture content of the sheet member or a parameter correlating with the moisture content and a control unit for controlling the sheet member heating means on the basis of detection information from the moisture content detecting means so that the moisture content approaches a predetermined optimum moisture content.