The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2004
Filed:
Oct. 24, 2000
Cheng-Hsien Chou, Tu-Cheng, TW;
Unitech Printed Circuit Board Corp., Tu-Cheng, TW;
Abstract
The present invention relates to a manufacturing method of rigid flexible printed circuit board. Inner layer circuit are etched on two side of a flexible basefilm and a flat cable for connecting the inner layer circuit on lateral sides is disposed on the middle part thereof. Then layer of outer copper foil without bondfilm made of reinforced fiber on the bottom side thereof is laminated on both sides of the flexible basefilm respectively and drilled a number of through holes on connecting points of preset circuitry thereof. Subsequently, each through hole is metalized and plated for electrically connecting outer copper foil and inner layer circuit on flexible basefilm by means of such plated layer. The copper foil on the top of the flat cable that is on the middle of the flexible basefilm is removed and out layer circuit is made on outer copper foil. At last, the outer layer circuit is covered by solder resist mask. In accordance with the fabricating process mentioned above, the cutting of redundant parts and the trouble of covering protective barrier on flat cable on the middle of the flexible basefilm could be avoided.