The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2004
Filed:
Oct. 30, 2002
Radoslav Ratchkov, Santa Clara, CA (US);
Maad Al-Dabagh, San Jose, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
An integrated circuit with a power and ground distribution system having a first conductive layer, a second conductive layer, and an insulating layer disposed between the first layer and the second layer. A first ring is formed in the first layer, where the first ring forms a first loop around a peripheral portion of the integrated circuit. First straps are formed in the first layer, where the first straps have connections to the first ring. First horizontal members are formed in the first layer, where the first horizontal members have connections to the first ring. Second horizontal members are formed in the first layer, where the second horizontal members do not have connections to the first ring. A second ring is formed in the second layer, where the second ring forms a second loop around the peripheral portion of the integrated circuit. The second ring is interleaved with the first ring. Second straps are formed in the second layer, where the second straps have connections to the second ring. Second vertical members are formed in the second layer, where the second vertical members have connections to the second ring. First vertical members are formed in the second layer, where the first vertical members do not have connections to the second ring. First vias form connections between the first vertical members and the first ring. Second vias form connections between the second horizontal members and the second ring. The first elements form a first subsystem such as for power, and the second elements form a second subsystem such as for ground.