The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2004
Filed:
Sep. 19, 2002
Tatsuo Suemasu, Tokyo, JP;
Takashi Takizawa, Tokyo, JP;
Fujikura Ltd., Tokyo, JP;
Abstract
In the formation of through wirings in a silicon substrate and so forth, there was a need for the development of a technology that would allow metal to be reliably filled particularly in the vicinity of openings of through holes and other fine holes. This invention provides a metal filling method and member with filled metal sections in which, in the inflow and filling of a plating solution into through holes of a substrate by immersing said substrate in heated and melted conductive metal, filled metal sections are formed by preliminarily forming a metal layer on the inner surface of one of the ends of through holes of this substrate as well as on substrate top surface around those openings, removing substrate on which inflow and filling of the plating solution into through holes has been completed from the plating solution, and then cooling to solidify the plating solution that has been filled into the through holes.