The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6743039 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 01, 2004

Filed:

Sep. 27, 2002
Applicant:
Inventors:

Hiroshi Shirai, Saitama, JP;

Akira Kubo, Tokyo, JP;

Assignee:

Tyco Electronics EC K.K., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/3625 ;
U.S. Cl.
CPC ...
H01R 1/3625 ;
Abstract

A ball grid array connector having an insulative housing with a plurality of contacts in electrical connection with corresponding solder balls that protrude from a surface of the housing. The solder balls form a soldering region for attachment to a circuit board. The housing has a center of gravity biased from a center of the soldering region, and a positional compensation member is attached to the housing and the circuit board. The positional compensation member prevents the housing from becoming inclined with respect to the circuit board when the solder balls are attached to the circuit board and prevents the housing from becoming inclined with respect to an electronic part when the electronic part is mounted to the housing on a side opposite from the circuit board.


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