The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2004

Filed:

Feb. 13, 2002
Applicant:
Inventors:

Takuya Satoh, Kanagawa-ken, JP;

Tatsumi Tsuchiya, Ayase, JP;

Yasuhiro Mita, Fujisawa, JP;

Lan Shi, Fujisawa, JP;

Hiroyoshi Yokome, Fujisawa, JP;

Tatsushi Yoshida, Chigasaki, JP;

Surya Pattanaik, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/00 ; B23K 5/00 ; B23K 2/014 ; B23K 3/700 ;
U.S. Cl.
CPC ...
B23K 1/00 ; B23K 5/00 ; B23K 2/014 ; B23K 3/700 ;
Abstract

An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.


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