The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2004

Filed:

Jan. 31, 2002
Applicant:
Inventors:

Satoru Ono, Aichi, JP;

Junji Koizumi, Aichi, JP;

Kuniyoshi Kondo, Aichi, JP;

Michiyoshi Matsumoto, Aichi, JP;

Yoshihiro Yamami, Aichi, JP;

Setsuo Morizane, Aichi, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 8/104 ;
U.S. Cl.
CPC ...
C08L 8/104 ;
Abstract

A resin molding having welding properties, flexibility, and shock impact resistance in a balanced manner. The resin molding has a welded seam, consisting of a resin composition, wherein the resin composition comprises (a) a polyphenylene sulfide resin and (b) an olefin based resin: wherein an amount of the (a) polyphenylene sulfide resin and the (b) olefin based resin is 80 weight % or more of the entire resin composition, and the content of the (b) olefin based resin is 10 to 100 parts by weight relevant to 100 parts by weight of the (a) polyphenylene sulfide resin, and wherein the tensile elongation at break is 20% or more.


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