The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2004
Filed:
Feb. 01, 2002
Applicant:
Inventors:
Steven P. Zuhoski, Rowlett, TX (US);
Mercer L. Brugler, Flower Mound, TX (US);
Cameron Gross, Allen, TX (US);
Edward L. Mickler, Austin, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/131 ; H01L 2/1469 ;
U.S. Cl.
CPC ...
H01L 2/131 ; H01L 2/1469 ;
Abstract
A method for fabricating a non-FLASH integrated circuit that minimizes Vmin shift. A protective overcoat ( ) is deposited to protect and encapsulate the top metal interconnect layer ( ). The protective overcoat ( ) is patterned and etched to form bondpad windows either before or after depositing the final metal interconnect layer ( ). A sinter that is normally performed after forming the bondpad windows is either omitted or the temperature of the sinter is kept at or below 350° C.