The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2004

Filed:

Oct. 04, 2002
Applicant:
Inventors:

Toshiaki Kawachi, Nagoya, JP;

Hideo Ishikawa, Nagoya, JP;

Masaaki Sakamoto, Nagoya, JP;

Assignee:

Daido Metal Co., Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 1/501 ; B32B 5/12 ; C22C 1/104 ; C22C 1/106 ; C25D 1/502 ;
U.S. Cl.
CPC ...
B32B 1/501 ; B32B 5/12 ; C22C 1/104 ; C22C 1/106 ; C25D 1/502 ;
Abstract

Disclosed is a sliding member having a bearing alloy layer and a composite plating film provided on the bearing alloy layer. The composite plating film is made of a lead alloy containing 0.1 to 10 mass percent in total of copper and 0.3 to 25 volume percent in total of co-deposited inorganic particles. The outermost surface layer of the composite plating film, which has a thickness proportion of 10 to 40% to the entire thickness of the composite plating film, does not contain inorganic particles and copper. The lower layer of the composite plating film contains Cu and inorganic particles, such as Si N , dispersed therein.


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