The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2004
Filed:
Apr. 24, 2000
Applicant:
Inventors:
Shigetoshi Segawa, Ehime, JP;
Hiroshi Ochi, Ehime, JP;
Yasuyuki Baba, Ehime, JP;
Osamu Shiraishi, Ehime, JP;
Masao Konishi, Ehime, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/122 ; B32B 3/126 ;
U.S. Cl.
CPC ...
B32B 3/122 ; B32B 3/126 ;
Abstract
A method for manufacturing a multi-layered ceramic substrate which enables to remove a shrinkage suppression sheet without damaging the multi-layered substrate. The shrinkage suppression sheets are formed on both faces of unfired laminated green sheets, and then the laminated green sheets are fired. For removing the shrinkage suppression sheets on both faces of the multi-layered ceramic substrate after sintering, water, ceramic powder, or water and ceramic powder mixture is sprayed together with compressed air.