The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2004
Filed:
Oct. 26, 2000
Applicant:
Inventors:
Shigeo Nakamura, Kawasaki, JP;
Tadahiko Yokota, Kawasaki, JP;
Assignee:
Ajinomoto Co., Inc., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 6/36 ; H05K 3/10 ; H05K 1/03 ;
U.S. Cl.
CPC ...
H05K 6/36 ; H05K 3/10 ; H05K 1/03 ;
Abstract
The present invention relates to a method of manufacturing a multilayered printed wiring board by a buildup system in which a conductive circuit layer and an insulating layer are alternately piled up. This method also involves using an adhesive film to facilitate manufacturing the multilayered printed wiring board having excellent surface smoothness at satisfactory yields.