The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2004
Filed:
Aug. 17, 2001
Shih-Chang Wu, Rancho Palos Verdes, CA (US);
Yaozhong Liu, Torrance, CA (US);
The Boeing Company, Chicago, IL (US);
Abstract
A multilayer radio frequency interconnect apparatus includes a plurality of laminated printed wiring boards made of a dielectric material with low loss characteristics for radio frequency electromagnetic radiation. In operation, a RF signal launches from a first signal conductor . A vertical transition from the first signal conductor to a second signal conductor is realized by a 3-wire transmission line. The center conductor of the 3-wire transmission line is a RF via . The two outer conductors are RF ground vias and connect the first RF ground conductor to the second RF ground conductor . These two RF ground vias are isolated from the ground planes which are located between RF signal layers . The advantage of this ground isolation is to maintain the 3-wire transmission line characteristic impedance and to reduce disturbance to electromagnetic fields such that a broadband design may be achieved. The RF ground vias are terminated at signal layers