The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2004
Filed:
Nov. 25, 2002
Bo Bijlenga, Amal, SE;
Fabian Zwick, Suhr, CH;
Stefan Linder, Zofingen, CH;
Patrick Erne, Elsau, CH;
ABB Research LTD, Zurich, CH;
Abstract
The power semiconductor module ( ) comprises a housing ( ), a covering panel ( ) and at least two submodules ( ). The submodules ( ) each comprise at least one semiconductor chip, which has two main electrodes which are electrically conductively connected to main connections ( ) of the submodules. The submodules ( ) are arranged alongside one another, and one of their two main surfaces is pressed against the covering panel ( ) of the module. The submodules are electrically connected in series. The maximun blocking voltage of the module is doubled by connecting the submodules, which are arranged alongside one another, in series. This reduces the length and the costs of the stack for hihg-voltage switch since fewer components are required for the same blocking voltages, in particular fewer modules and cooling elements.