The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2004

Filed:

Aug. 03, 2000
Applicant:
Inventors:

Sandeepan Bhattacharya, Bloomington, MN (US);

Shri Hari Narayan, Minneapolis, MN (US);

Rich Lawrence Segar, Eagan, MN (US);

Keefe Michael Russell, Robbinsdale, MN (US);

Assignee:

JPMorgan Chase Bank, New York, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/48 ;
U.S. Cl.
CPC ...
G11B 5/48 ;
Abstract

The present invention provides a system, method and apparatus for controlling the coverage of an adhesive bond area between a suspension and a flex circuit interconnect by etching an area of the suspension to create a bonding area. The etching process prevents bonding of the flex circuit interconnect to the suspension in a tail and a side region allowing movement between the flex circuit and suspension, wherein the movement dampens a first torsion resonance mode. Better control of the bonding area between the interconnect and the suspension using the “adhesive down” helps reduce the variation in the roll stiffness of the suspension thereby reducing the fly height variation.


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