The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2004
Filed:
Jul. 19, 2002
Alfonso Benjamin Amparan, Fort Collins, CO (US);
David Lee Gines, Fort Collins, CO (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
Device interconnects and methods of making the same are described. In one aspect, a device interconnect system includes a bonding pad portion and a transmission line portion. The bonding pad portion is disposed on a device substrate and is constructed and arranged for electrical connection to a bond wire. The transmission line portion is disposed on the device substrate and is constructed and arranged to electrically couple the bonding pad portion to a device formed on the device substrate. The transmission line portion has a width dimension that is substantially parallel to the device substrate and a height dimension that is substantially perpendicular to the device substrate. The width dimension and the height dimension of the transmission line portion both vary from the bonding pad portion to the device.