The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2004
Filed:
Sep. 12, 2002
Applicant:
Inventor:
Robert M. Hilton, Queensland, AU;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A flip-chip package uses a substrate having bond pad spacing that matches terminal spacing on a chip at an elevated temperature that is an expected operating temperature of the chip. The elevated temperature can be the midpoint of the desired temperature cycle of the chip so that deformations of the electrical connections in one direction balance deformations in the opposite direction during temperature cycling. Matching spacing at an elevated temperature, even a temperature less than the bonding temperature, permits a better alignment at the bonding temperature for formation of stronger bonds.