The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6737742 B1

PDF
Full Text
Expired
Date of Patent:
May. 18, 2004

Filed:

Sep. 11, 2002
Applicant:
Inventor:

Jennifer R. Sweterlitsch, Vestal, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/302 ; H01L 2/334 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/302 ; H01L 2/334 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract

A space-saving integrated circuit package employs two printed circuit boards joined together, the upper board having an integrated circuit attached by flip-chip technology and the lower board having a cavity for holding an integrated circuit that is located beneath the upper integrated circuit, the lower integrated circuit being bonded to the bottom of the upper board below the upper integrated circuit and electrically connected to wiring on the lower surface of the lower board by wire bond connections.


Find Patent Forward Citations

Quick Actions:

Sweterlitsch, Jennifer. (2004). Stacked package for integrated circuits (U.S. Patent No. 6737742). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6737742

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…